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3northway lane north latham,new york 12110. tollfree:1.800.984.5337 phone:1.518.956.2980 fax:1.518.785.4725 http://www.marktechopto.com specification part no. : MT1064S15-G-A 4.8mm round led lamp with holder observe precaution for handling electro static sensitive devices attention
MT1064S15-G-A 4.8mm round led lamp with holder ver.: 01 date : 2007/11/13 page: 1 /5 package dimensions 11.3 1.0 861.05 31.5 0.7 tin plating 4.8 7.0 5.9 2.450.5 black wire cathode red wire anode 4.0 1.5 notes: 1. all dimensions are in mm. 2. tolerance is 0.25mm unless otherwise noted. description led chip part no. material emitting color lens color MT1064S15-G-A gap/gap green green diffused
MT1064S15-G-A 4.8mm round led lamp with holder ver.: 01 date : 2007/11/13 page: 2 /5 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation per lamp p d 240 mw reverse voltage per lamp v r 5 v d.c. forward current per lamp if 30 ma peak current per lamp (1/10duty duty,0.1ms pulse width.) if(peak) 100 ma operating temperature range topr. -25 to +85
storage temperature range tstg. -40 to +100
soldering temperature(1.6mm from body) tsol dip soldering: 260 for
5sec. hand soldering: 350 for 3 sec.
electrical and optical characteristics: parameter symbol condition min. typ. max. unit luminous intensity per lamp i v if=20ma 20 35 mcd forward voltage per lamp vf if=20ma 18.1 v peak wavelength per lamp a viewing angle per lamp 21/2 if=20ma 38 deg spectrum line halfwidth per lamp ?
MT1064S15-G-A 4.8mm round led lamp with holder ver.: 01 date : 2007/11/13 page: 3 /5 typical electrical/optical characteristic curves (25
ambient temperature un less otherwise noted) 24 forward voltage (v) forward current vs.applied voltage 20 16 28 32 forward current if(ma) 10 20 40 30 50 12 20.0 forward current (ma) forward current vs. luminous intensity relative luminous intensity 10.0 0 10 20 40 30 50 30.0 0.0 temperature( f c) forward current vs. ambient temperature 0 204060 100 80 forward current if(ma) 10 20 40 30 50 radiation pattern 1.0 0.7 0.8 0.9 0.1 0.5 0.3 0.2 0.4 0.6 90 70 80 50 60 20 0 10 30 40
MT1064S15-G-A 4.8mm round led lamp with holder ver.: 01 date : 2007/11/13 page: 4 /5 precautions: take note of the following in use of led 1. temperature in use since the light generated inside the led needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. consequently, the heat resistant ability of the resin used for led is usually low; therefore, please be careful on the following during use. avoid applying external force, stress, and excessi ve vibration to the resins and terminals at high temperature. the glass transition temperature of epoxy resin used for the led is approximately 120-130
. at a temperature exceeding this limit, the co efficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. if external force or stress is applied at that time, it may cause a wire rupture. 2. soldering please be careful on the following at soldering. after soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temp erature), (1) soldering measurements: distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) dip soldering: pre-heat: 90
max. (backside of pcb), within 60 seconds. solder bath: 260 ? 5
(solder temperature), within 5 seconds. (3) hand soldering : 350
max. (temperature of solderin g iron tip), within 3 seconds 3. insertion pitch of the led leads and pitch of mounting holes need to be same 4. others since the heat resistant ability of the led re sin is low, smd components are used on the same pcb, please mount the led after adhesive baking process for smd components. in case adhesive baking is done after led lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the led and follow the conditions below. baking temperature: 120
max. baking time: within 60 seconds if soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the led to normal temperature.

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